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25XX080C/D
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1
2
3
A
D
A2
E
A1
b1
b
e
L
Units
eB
INCHES
c
Number of Pins
Pitch
Dimension Limits
N
e
MIN
NOM
8
.100 BSC
MAX
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
A
A2
A1
E
E1
D
L
c
b1
b
eB
–
.115
.015
.290
.240
.348
.115
.008
.040
.014
–
–
.130
–
.310
.250
.365
.130
.010
.060
.018
–
.210
.195
–
.325
.280
.400
.150
.015
.070
.022
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-018B
? 2009 Microchip Technology Inc.
DS22151A-page 17
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